24-4518-10

Beschreibung :
CONN IC DIP SOCKET 24POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
10μin (0.25μm)
Contact Finish Thickness - Post :
200μin (5.08μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polyamide (PA46),Nylon 4/6,Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
24 (2 x 12)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
518
Termination :
Solder
Type :
DIP,0.4" (10.16mm) Row Spacing
倍数 :
1

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