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Entdecken Sie 2,625 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Shape Height Length Width Plating Attachment Method
228031800
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
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25-109FSDS-SU-300
Leader Tech Inc.
Anfrage
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 SU 300"--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Unplated Adhesive
228032200
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
- - - - - - - - - -
6000-0225-71
Leader Tech Inc.
Anfrage
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-
MOQ: 1  MPQ: 1
2.25" X 50 LONG TECHMESH TAPE--
- - Gasket Sleeve - - - - 2.250" (57.15mm) Tin -
4B88ABH1K09600
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
GK NICU NRS PU V0 BELL
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Bell 0.091" (2.30mm) 96.000" (243.84cm) 0.315" (8.00mm) - -
1355001850
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
OBSTK,94603001 REV F
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98010502
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
CSTR,STR,BF,USFT
- - - - - - - - - -
6000-0050-72
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
.500" X 50 LONG TECHMESH TAPE--
- - Gasket Sleeve - - - - 0.500" (12.70mm) Tin -
4B99AB50B09600
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
GK NICU NRS PU NR REC
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14-37FS-BD-300""
Leader Tech Inc.
Anfrage
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-
MOQ: 1  MPQ: 1
0.14 X 0.36 BD 300"--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.140" (3.56mm) 25.00 (7.62m) 0.370" (9.40mm) Unplated Adhesive
6-34T-BD-300
Leader Tech Inc.
Anfrage
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-
MOQ: 1  MPQ: 1
0.07 X 0.34 BD 300--6-34T-BD-300
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 25.00 (7.62m) 0.340" (8.64mm) Unplated Adhesive
27229375
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
LOK ROD 1/2X12
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6000-0225-72
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
2.25" X 50 LONG TECHMESH TAPE--
- - Gasket Sleeve - - - - 2.250" (57.15mm) Tin -
8300015044
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
ELMT,MT,CUTIPLAT,RL
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23-60FS-BD-400
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 400--FOLDED SERIE
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 33.33 (10.16m) 0.600" (15.24mm) Unplated Adhesive
228031300
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
- - - - - - - - - -
228031000
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
- - - - - - - - - -
228031400
Laird Technologies EMI
Anfrage
-
-
MOQ: 1  MPQ: 1
AP,STR,SNB,RA,CM
- - - - - - - - - -
25-109FSDS-BD-300
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.25 X 1.09 BD 300"--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 25.00 (7.62m) 1.090" (27.69mm) Unplated Adhesive
25-78FS-BD-300
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.25 X 0.78 BD 300"--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 25.00 (7.62m) 0.780" (19.81mm) Unplated Adhesive