- Series：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 557 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NIB,USFT,PSA
|
- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,BF,USF,RIV
|
- | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Rivet | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT
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Foldover | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG COIL BF USF PSA
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Foldover | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
PCLIP,STR,SNB,USF,CLO
|
- | Beryllium Copper | 0.305" (7.75mm) | 11.945" (303.40mm) | - | Tin | 299.21μin (7.60μm) | Clip | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNSAT,USFT,RIV
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | Beryllium Copper | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIVIT
|
- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,USFT,RIV
|
- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
|
- | Beryllium Copper | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | Beryllium Copper | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIV
|
- | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,BF,USFT
|
- | Beryllium Copper | 0.170" (4.32mm) | 24.000" (609.60mm) | 0.195" (4.95mm) | - | - | Snap-In | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,USFT,RIV
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Rivet | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USFT,PSA
|
Foldover | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL CDY PSA
|
All-Purpose | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Cadmium + Yellow Chromate | 299.21μin (7.60μm) | Adhesive |
