- Series：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 557 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL ZNY PSA
|
Foldover | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL NIB PSA
|
Foldover | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL SNB PSA
|
All-Purpose | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT,PSA
|
Foldover | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIV
|
- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,ZNC,USFT,PSA
|
- | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
STS3,STR,ZNY,USFT
|
- | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,BF,USFT,CLO
|
- | Beryllium Copper | 0.305" (7.75mm) | 11.945" (303.40mm) | - | - | - | Clip | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 8.64X609.6MM
|
Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | - | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,USFT,RIV
|
- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
|
Foldover | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,USF,RIV
|
- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
|
- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive |
