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- Material：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 557 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,NIB,PSA
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Foldover | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNSAT,PSA
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- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,PSA
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- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,NIB,PSA
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- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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S3,STR,BF
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- | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Rivet | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,PSA
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- | Beryllium Copper | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SU,PSA
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- | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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LS,STR,SNB,PSA
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- | Beryllium Copper | 0.300" (7.62mm) | 18.750" (476.25mm) | 0.800" (20.32mm) | Tin | 299.21μin (7.60μm) | Hardware | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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S3,STR,NIB,RIV
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- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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S3,STR,NIB,RIV
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- | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,NIB,RIVIT
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- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,NIE,RIV
|
- | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,NID,USFT,CLO
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Clip-On | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL SNB
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Large Enclosure | Beryllium Copper | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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AP COIL BF PSA
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All-Purpose | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,SNB,PSA
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Foldover | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,TLN,ZNY
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- | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,TLN,SNB
|
- | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,DLN,SNB
|
- | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Clip |
