Entdecken Sie 5 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Operating Temperature Type Material Shape Height Length Plating Plating - Thickness Attachment Method
97094102
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
FINGERSTOCK BECU 5.1X609.6MM
121°C Fingerstock Beryllium Copper - 0.170" (4.32mm) 24.000" (609.60mm) - - Snap-In
97094117
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
FLX,STR,SNB
121°C Fingerstock Beryllium Copper - 0.170" (4.32mm) 24.000" (609.60mm) Tin 299.21μin (7.60μm) Snap-In
97094121
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
FLX,STR,SU
121°C Fingerstock Beryllium Copper - 0.170" (4.32mm) 24.000" (609.60mm) - - Snap-In
98094102
Laird Technologies EMI
Anfrage
-
-
MOQ: 1  MPQ: 1
FLX,STR,BF,USFT
121°C Fingerstock Beryllium Copper - 0.170" (4.32mm) 24.000" (609.60mm) - - Snap-In
SG016195P-48
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
.016"H X .195"W X 48"L--P SHAPED
-40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) P-Shape 0.016" (0.41mm) 4.00 (1.22m) - - -