Entdecken Sie 4 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Operating Temperature Type Material Shape Height Length Plating Plating - Thickness Attachment Method
97053602
Laird Technologies EMI
436
3 tage
-
MOQ: 1  MPQ: 1
GASKET BECU 17X609.6MM
121°C Fingerstock Beryllium Copper - 0.310" (7.87mm) 24.000" (609.60mm) - - Adhesive
97053617
Laird Technologies EMI
Anfrage
-
-
MOQ: 1  MPQ: 1
AP,STR,SNB,PSA
121°C Fingerstock Beryllium Copper - 0.310" (7.87mm) 24.000" (609.60mm) Tin 299.21μin (7.60μm) Adhesive
SG670670R-1.60
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
.670"H X .670"W X 1.60"L--RECTAN
-40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangular 0.670" (17.02mm) 1.600" (40.64mm) - - -
98053602
Laird Technologies EMI
Anfrage
-
-
MOQ: 1  MPQ: 1
AP,STR,BF,USF,PSA
121°C Fingerstock Beryllium Copper - 0.310" (7.87mm) 24.000" (609.60mm) - - Adhesive