- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 44 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
328
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3 tage |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 7.11X406.4MM
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- | - | - | - | - | - | 16.000" (406.40mm) | - | - | - | ||
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Laird Technologies EMI |
102
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3 tage |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
55
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3 tage |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 24.000" (609.60mm) | - | - | Adhesive | ||
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Leader Tech Inc. |
76
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3 tage |
-
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MOQ: 1 MPQ: 1
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FSG，.252"H X .280"W X 48"L
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- | - | Fabric Over Foam | - | C-Fold | 0.252" (6.40mm) | 48.000" (121.90cm) | - | - | - | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X4.32MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.169" (4.29mm) | - | - | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X9.04MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.356" (9.04mm) | - | - | Slot | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X13.82MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.543" (13.79mm) | - | - | Slot | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X18.54MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.730" (18.54mm) | - | - | Slot | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP COIL BF
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NID,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
