Hersteller:
Entdecken Sie 230 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
0C97055518
Laird Technologies EMI
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MOQ: 1  MPQ: 1
TWT COIL NIE PSA
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.340" (8.64mm) Nickel 299.21μin (7.60μm) Adhesive
23-S-60FS-SN-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.23 X 0.60 SN 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.600" (15.24mm) Tin Flash Adhesive
SG250375D-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
.250"H X .375"W X 24"L--D SHAPED
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) D-Shape 0.250" (6.35mm) 0.375" (9.53mm) - - -
SG106445K-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
.106"H X .445"W X 24"L--KNIFE ED
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Knife 0.160" (4.06mm) 0.445" (11.30mm) - - -
98050002
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP,COIL,BF,USFT,PSA
- 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.600" (15.24mm) - - Adhesive
SG040275R-24.00
Leader Tech Inc.
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MOQ: 1  MPQ: 1
.040"H X .275"W X 24"L--RECTANGU
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangular 0.040" (1.02mm) 0.275" (6.99mm) - - -
SG375500D-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
.375"H X .500"W X 24"L--D SHAPED
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) D-Shape 0.375" (9.53mm) 0.500" (12.70mm) - - -
98053602
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP,STR,BF,USF,PSA
- 121°C Fingerstock Beryllium Copper - 0.310" (7.87mm) 0.670" (17.02mm) - - Adhesive
98053802
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP,STR,BF,USF,PSA
- 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 0.780" (19.81mm) - - Adhesive
3-20T-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.20 BD 24--3-20T-BD-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.200" (5.08mm) Unplated - Adhesive
3-20T-BD-24-NTP
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.20 BD 24 NTP--3-20T-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.200" (5.08mm) Unplated - Adhesive
SG040125R-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
.040"H X .125"W X 24"L--RECTANGU
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangular 0.040" (1.02mm) 0.125" (3.18mm) - - -
3-23T-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.23 BD 24--3-23T-BD-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Unplated - Adhesive
3-23T-BD-24-NTP
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.23 BD 24 NTP--3-23T-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Unplated - Adhesive
3-23TV-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.08 BD 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.080" (2.03mm) Unplated - Adhesive
3-23TV30-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.08 BD 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.080" (2.03mm) Unplated - Adhesive
3-S-23T-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.23 BD 24--3-S-23T-BD-24
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Unplated - Adhesive
3-S-23TV-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.23 BD 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Unplated - Adhesive
25-109FSDS-BD-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.25 X 1.09 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 1.090" (27.69mm) Unplated - Adhesive
0C97050017
Laird Technologies EMI
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MOQ: 1  MPQ: 1
AP COIL SNB PSA
All-Purpose 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.600" (15.24mm) Tin 299.21μin (7.60μm) Adhesive