- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 230 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 18.29X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.209" (5.31mm) | 0.725" (18.42mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGRSTOCK BECU ALY 8.64X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 15.24X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 19.81X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 5.1X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.195" (4.95mm) | - | - | Snap-In | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 25X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.400" (10.16mm) | 0.980" (24.89mm) | - | - | Clip | ||
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Laird Technologies EMI |
7
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3 tage |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 6.6X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.260" (6.60mm) | - | - | Snap-In | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Leader Tech Inc. |
243
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3 tage |
-
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MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.300" (7.62mm) | - | - | - | |||
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Leader Tech Inc. |
476
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3 tage |
-
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MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | - | Adhesive | |||
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Laird Technologies EMI |
164
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3 tage |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 2.29X609.6MM
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Twist | - | - | - | - | - | 0.090" (2.29mm) | - | - | - | |||
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Leader Tech Inc. |
99
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3 tage |
-
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MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.340" (8.64mm) | Tin | - | - | |||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRSG PU V0 DSH
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- | - | Fabric Over Foam | - | D-Shape | 0.079" (2.00mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU PTAF TPE HB DSH
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- | - | Fabric Over Foam | - | D-Shape | 0.142" (3.60mm) | 0.252" (6.40mm) | - | - | - | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRS PU V0 REC
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- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 0.039" (1.00mm) | 0.201" (5.10mm) | - | - | - | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG，STR,BF
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | - | - | Adhesive |
