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- Material:
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- Shape:
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- Height:
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- Width:
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- Plating:
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- Plating - Thickness:
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- Attachment Method:
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- Ausgewählte Bedingungen:
Entdecken Sie 230 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Leader Tech Inc. |
Anfrage
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-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.76 BD 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 SNPB 24--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Lead,Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.03 X 0.08 ST 24 NTP--TWIST RIG
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.080" (2.03mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 SN 24--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FLX,STR,BF,USFT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 0.195" (4.95mm) | - | - | Snap-In | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.015"H X .200"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Rectangular | 0.015" (0.38mm) | 0.200" (5.08mm) | - | - | - | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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.120"H X .150"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | D-Shape | 0.120" (3.05mm) | 0.150" (3.81mm) | - | - | - | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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.125"H X .250"W X 24.00"L--D SHA
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | D-Shape | 0.125" (3.18mm) | 0.250" (6.35mm) | - | - | - | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.76 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 NI 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.76 NI 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.760" (19.30mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.06 X 0.50 NI 24--TWIST DOUBLE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.500" (12.70mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.23 SNPB 24 NTP--3-23T-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Lead,Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.157"H X .500"W 24"L--BELL SHAPE
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Bell | 0.157" (4.00mm) | 0.500" (12.70mm) | - | - | - | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 SU 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 SU 24--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.780" (19.81mm) | Unplated | - | Adhesive |