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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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-
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MOQ: 1 MPQ: 1
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LOK ROD 1/2X12
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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2.25" X 50 LONG TECHMESH TAPE--
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- | - | Gasket Sleeve | - | - | - | 2.250" (57.15mm) | Tin | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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ELMT,MT,CUTIPLAT,RL
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.23 X 0.60 BD 400--FOLDED SERIE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 33.33 (10.16m) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 SN 300"--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 BD 300"--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.08 X 0.25 BD 400--FOLDED SERIE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
|
- | - | - | - | - | - | - | - | - | - | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,MOD
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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VPEDF,REC ,#8643,CRY
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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24"X24"X2-1/4" AN-77 MICROWAVE A
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SHLD,PCS,BECU,NISNSAT 0.38X0.75X
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