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Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Height Length Width Plating Plating - Thickness Attachment Method
32-78AH-BD-18
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.32 X 0.78 BD 18--32-78AH-BD-18
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.320" (8.13mm) 18.000" (457.20mm) 0.780" (19.81mm) Unplated - Adhesive
3-S-23TV30-NI-24
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.03 X 0.08 NI 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Nickel Flash Adhesive
0097013908N02531
Laird Technologies EMI
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MOQ: 1  MPQ: 1
CSTR PCS SNSAT CTL
- - - - - - 0.440" (11.18mm) - - -
32-78AH-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.32 X 0.78 BD 16--32-78AH-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.320" (8.13mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated - Adhesive
11-45CD-SN-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.11 X 0.45 CD SN 16--11-45CD-SN
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.450" (11.43mm) Tin Flash Adhesive
11-45CT-SN-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.11 X 0.45 CT SN 16--11-45CT-SN
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.450" (11.43mm) Tin Flash Adhesive
6-34UT-070-SN-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.07 X 0.22 X 070 SN 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) 16.000" (406.40mm) 0.220" (5.59mm) Tin Flash Adhesive
22-77RR-SN-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.23 X 0.77 SN 16--22-77RR-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.220" (5.59mm) 16.000" (406.40mm) 0.770" (19.56mm) Tin Flash Adhesive
25-109C-070-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 070 BD 16--25-109C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) 1.090" (27.69mm) Unplated - Adhesive
25-109C-120-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 120 BD 16--25-109C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) 1.090" (27.69mm) Unplated - Adhesive
25-109C-130-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 130 BD 16--25-109C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) 1.090" (27.69mm) Unplated - Adhesive
7-21C-045-DL-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.07 X .25 X 045 BD 16--7-21C-04
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 16.000" (406.40mm) 0.250" (6.35mm) Unplated - Adhesive
4B40HC51K00720
Laird Technologies EMI
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 DSH
- - - - - - - - - -
22-60AH-SN-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.22 X 0.60 SN 16--22-60AH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.220" (5.59mm) 16.000" (406.40mm) 0.600" (15.24mm) Tin Flash Adhesive
41-113FS-SN-12
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.41 X 1.13 SN 12--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.410" (10.41mm) 12.000" (304.80mm) 1.130" (28.70mm) Tin Flash Adhesive
8-19PCI-BD-18
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.067 X 0.19 BD 18--8-19PCI-BD-1
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) 18.000" (457.20mm) 0.190" (4.83mm) Unplated - Adhesive
8-19PCI-BD-9.0
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.067 X 0.19 BD 9.0--8-19PCI-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) 9.000" (228.60mm) 0.190" (4.83mm) Unplated - Adhesive
8-19PCI-SS-5.60
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.067 X 0.19 BD 5.60--8-19PCI-SS
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 5.600" (142.24mm) 0.190" (4.83mm) - - Adhesive
6-45LPH-060-BD-16-NTP
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.06 X 0.45 X 060 BD 16 NTP--6-4
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) 16.000" (406.40mm) 0.450" (11.43mm) Unplated - Adhesive
8-45LPC-060-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.08 X 0.45 X 060 BD 16--8-45LPC
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.080" (2.03mm) 16.000" (406.40mm) 0.450" (11.43mm) Unplated - Adhesive