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- Operating Temperature：
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Anfrage
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-
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MOQ: 1 MPQ: 1
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0.09 X 0.78 NI 16--9-78D-A-NI-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.09 X 0.92 BD 16--8-92RC-BD-16-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.920" (23.37mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 NI 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.14 X 0.36 SN 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.22 X 0.60 SN 15--22-62DT-SN-15
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.41 X 1.13 BD 12--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.067 X 0.177 NI 9.0--7-19PCI-NI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 9.000" (228.60mm) | 1.800" (45.72mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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.032"T X 6.00"W--8100-0015-82
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- | -62°C ~ 260°C | Gasket | Conductive Elastomer | 0.032" (0.81mm) | - | 6.000" (152.40mm) | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU PTAFG NF V0 REC
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 NI 16--11-32AH-NI-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.14 X 0.510 NI 16--FOLDED SERIE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.14 X 0.51 SN 16.0--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL NIE
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.35 SN 15 NTP--11-35DT-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.13 X 0.37 SN 16.0--13-37AH-SN-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.12 X 0.60 BD 16--12-60LPAH-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,SNB,USFT,RIVIT
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,NIB,USFT,RIV
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.62 NI 15--22-62DT-NI-15
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.10 X 0.30 X 045 DL BD 16--10-3
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TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive |
