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- Operating Temperature：
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- Type：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,SNB,USF,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,FRG,BF
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,BF,USFT
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTCK ULTRASFT 8.64X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,BF,PSA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,BF,PSA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,BF,USFT,RIV
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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8000 SERIES-ORIENTED WIRE--8200-
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- | -62°C ~ 260°C | Gasket | Conductive Elastomer | 0.062" (1.57mm) | - | 0.250" (6.35mm) | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.22 X 0.60 BD 16--22-60RH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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0.03 X 0.20 SN 24--3-20T-SN-24--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.23 BD 24 NTP--3-S-23T-B
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.067 X 0.177 BD 16--7-19PCI-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 16.000" (406.40mm) | 1.800" (45.72mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.067 X 0.177 BD 18--7-19PCI-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 18.000" (457.20mm) | 1.800" (45.72mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.067 X 0.177 NI 4.6--7-19PCI-NI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 4.600" (116.84mm) | 1.800" (45.72mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.067 X 0.177 SS 14.60--7-19PCI-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 14.600" (370.84mm) | 0.180" (4.57mm) | - | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.067 X 0.177 SS 18.0--7-19PCI-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 18.000" (457.20mm) | 0.180" (4.57mm) | - | - | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.067 X 0.177 SS 4.60--7-19PCI-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 4.600" (116.84mm) | 0.180" (4.57mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
