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- Operating Temperature：
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- Type：
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- Material：
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- Height：
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- Plating：
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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-
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MOQ: 1 MPQ: 1
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CLO,STR,DLN,NIB,CTL
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK,NICU,NRSG,PU,V0,TRI
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 SN 1.291--11-S-32AF-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 1.291" (32.79mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,MRG,NIE
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,MRG,NIB
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL SNSAT PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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TWT COIL SNB PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRSG PU V0 BELL
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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IO NICU MESHG PU V0 REC
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 SN 6.90--11-S-32AF-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 6.900" (175.26mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,STR,SNB,USFT
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- | 121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.325" (8.26mm) | Tin | 299.21μin (7.60μm) | Slot | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 BD 47.625 NTP--FOLDE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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ENSL,SILSP,SCF,PSA,RL
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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EGW,AL
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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EGW,SS
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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EGW,AL
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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EGW,SS
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,SNB,RIV,CTL
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BATCON,NIE
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.13 X 0.30 SN 0.356--13-30RH-SN
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 0.356" (9.04mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive |
