Entdecken Sie 7 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Packaging Series Applications Mounting Type Voltage - Rated Features Capacitance Range Kit Type Packages Included
SOFT E1 KIT
TDK Corporation
8
3 tage
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MOQ: 1  MPQ: 1
CAP KIT CER 0.01UF-10UF 180PCS
Plastic Box with Bin Guide C Boardflex Sensitive Surface Mount,MLCC 25 ~ 630 V Soft Termination 0.01μF ~ 10μF Ceramic 0805 ~ 2220 (2012 ~ 5750 Metric)
MEGA E1 KIT
TDK Corporation
6
3 tage
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MOQ: 1  MPQ: 1
CAP KIT CER 0.1UF-100UF 180PCS
Plastic Box with Bin Guide MEGACAP,CKG SMPS Filtering,Bypass,Decoupling Surface Mount,MLCC 16 ~ 630 V Low ESL,Low ESL (Stacked) 0.1μF ~ 100μF Ceramic Non-Standard SMD
V-CHIP-KIT4
Cornell Dubilier Electronics (CDE)
Anfrage
-
-
MOQ: 1  MPQ: 1
CAP KIT ALUM 10UF-1000UF 180PCS
Bulk AFC,AFK General Purpose Surface Mount 10 ~ 100 V - 10μF ~ 1000μF Aluminum Radial,Can - SMD
SAMPLE KIT 1010
TDK Corporation
Anfrage
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MOQ: 1  MPQ: 1
CAP KIT CER 0.01UF-10UF 180PCS
Notebook C Boardflex Sensitive Surface Mount,MLCC 25 ~ 630 V Soft Termination 0.01μF ~ 10μF Ceramic 0805 ~ 2220 (2012 ~ 5750 Metric)
TAN ENG KIT 11
KEMET
Anfrage
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MOQ: 1  MPQ: 1
CAP KIT TANT POLY 1-220UF 180PCS
Binder T491,T494,T520,T528 General Purpose Surface Mount 4 ~ 20 V - 1μF ~ 220μF Tantalum (Polymer) 0805 ~ 2917 (2012 ~ 7343 Metric)
Q109306
Panasonic Electronic Components
Anfrage
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MOQ: 1  MPQ: 1
CAP KIT ALUM 0.1UF-100UF 180PCS
Notebook KG General Purpose Through Hole 6.3 ~ 50 V - 0.1μF ~ 100μF Aluminum Radial
NHG-KIT
Panasonic Electronic Components
Anfrage
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MOQ: 1  MPQ: 1
CAP KIT ALUM 0.1UF-2200UF 180PCS
Notebook NHG General Purpose Through Hole 50V - 0.1μF ~ 2200μF Aluminum Radial