- Series：
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- Applications：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Current - Supply：
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- Ausgewählte Bedingungen:
Entdecken Sie 625 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Current - Supply | |
|
|
|
NXP USA Inc. |
2,600
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | Processor | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
6,749
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
20,111
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PMU I.MX35/51/37/27 186BGA
|
Tray | - | Battery Management，Display (LED Drivers)，Handheld/Mobile Devices，Power Supply | - | -40°C ~ 85°C | 186-LFBGA | 186-PBGA (12x12) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
1,666
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 206MAPBGA
|
Tray | - | General Purpose | 1.8 V ~ 4.5 V | -40°C ~ 85°C | 206-LFBGA | 206-MAPBGA (13x13) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
2,000
|
3 tage |
-
|
MOQ: 2000 MPQ: 1
|
IC PWR MGMNT DC-DC MULT 56-QFN
|
Tape & Reel (TR) | - | Processor | 2.7 V ~ 5.5 V | -20°C ~ 85°C | 56-TFQFN Exposed Pad | 56-QFN-EP (7x7) | Surface Mount | 86mA | ||
|
|
|
NXP USA Inc. |
5,699
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MNGMT DC-DC MULT 56-QFN
|
Cut Tape (CT) | - | Processor | 2.7 V ~ 5.5 V | -20°C ~ 85°C | 56-TFQFN Exposed Pad | 56-QFN-EP (7x7) | Surface Mount | 86mA | ||
|
|
|
NXP USA Inc. |
5,699
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MNGMT DC-DC MULT 56-QFN
|
- | - | Processor | 2.7 V ~ 5.5 V | -20°C ~ 85°C | 56-TFQFN Exposed Pad | 56-QFN-EP (7x7) | Surface Mount | 86mA | ||
|
|
|
NXP USA Inc. |
815
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | Processor | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
1,897
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
857
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
798
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC IGNITION INJECTOR 32-SOIC
|
Tube | - | Automotive | 4.5 V ~ 36 V | -40°C ~ 125°C | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC EP | Surface Mount | 10mA | ||
|
|
|
NXP USA Inc. |
361
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
Tray | - | Audio，Video | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
488
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 56QFN
|
Tray | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | Surface Mount | 250μA | ||
|
|
|
NXP USA Inc. |
227
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 56QFN
|
Tray | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | Surface Mount | 250μA | ||
|
|
|
NXP USA Inc. |
195
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | - | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
1,747
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
290
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | 2.8 V ~ 5.5 V | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
1,300
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 56-QFN
|
Tray | - | Processor | 2.7 V ~ 5.5 V | -20°C ~ 85°C | 56-TFQFN Exposed Pad | 56-QFN-EP (7x7) | Surface Mount | 86mA | ||
|
|
|
NXP USA Inc. |
220
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC DSP MULTI COIL 5W 5V 64LQFP
|
Tray | Automotive，AEC-Q100 | Wireless Power Transmitter | 2.7 V ~ 3.6 V | -40°C ~ 105°C | 64-LQFP | 64-LQFP (10x10) | Surface Mount | - | ||
|
|
|
NXP USA Inc. |
471
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MOTOR DRIVER 36V 48LQFP
|
Tray | - | Pump，Valve Controller | 6 V ~ 36 V | -40°C ~ 125°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | Surface Mount | - |
