Entdecken Sie 86 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Packaging Applications Voltage - Supply Package / Case Supplier Device Package Current - Supply
MC33FS6522LAE
NXP USA Inc.
195
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6500NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6510NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 1.5A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33664ATL1EG
NXP USA Inc.
118
3 tage
-
MOQ: 1  MPQ: 1
TRANSFORMER PHYSICAL LAYER
Tube Isolated Communications Interface 4.5 V ~ 7 V 16-SOIC (0.154",3.90mm Width) 16-SOIC 40mA
MC33FS6520NAE
NXP USA Inc.
238
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS4500CAE
NXP USA Inc.
160
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6500CAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6500LAE
NXP USA Inc.
240
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6520CAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6521NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6502CAE
NXP USA Inc.
150
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS4502LAE
NXP USA Inc.
240
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6502LAE
NXP USA Inc.
123
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6523CAE
NXP USA Inc.
144
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6510CAE
NXP USA Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 1.5A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS4503CAE
NXP USA Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6503CAE
NXP USA Inc.
9
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS4500NAER2
NXP USA Inc.
Anfrage
-
-
MOQ: 2000  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tape & Reel (TR) System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6500NAER2
NXP USA Inc.
Anfrage
-
-
MOQ: 2000  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tape & Reel (TR) System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6510NAER2
NXP USA Inc.
Anfrage
-
-
MOQ: 2000  MPQ: 1
SYSTEM BASIS CHIP DCDC 1.5A VCO
Tape & Reel (TR) System Basis Chip -1.0 V ~ 40 V 48-LQFP Exposed Pad 48-LQFP (7x7) -