- Packaging：
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- Series：
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- Applications：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Ausgewählte Bedingungen:
Entdecken Sie 106 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Applications | Operating Temperature | Package / Case | Supplier Device Package | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Applications | Operating Temperature | Package / Case | Supplier Device Package | Current - Supply | |
|
|
|
Texas Instruments |
1,000
|
3 tage |
-
|
MOQ: 1000 MPQ: 1
|
IC PWM PWR DRVR HI-EFF 32-HLQFP
|
Tape & Reel (TR) | - | Thermoelectric Cooler | -40°C ~ 85°C | 32-LQFP Exposed Pad | 32-HLQFP (7x7) | 4mA | ||
|
|
|
Texas Instruments |
2,407
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWM PWR DRVR HI-EFF 32-HLQFP
|
Cut Tape (CT) | - | Thermoelectric Cooler | -40°C ~ 85°C | 32-LQFP Exposed Pad | 32-HLQFP (7x7) | 4mA | ||
|
|
|
Texas Instruments |
2,407
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWM PWR DRVR HI-EFF 32-HLQFP
|
- | - | Thermoelectric Cooler | -40°C ~ 85°C | 32-LQFP Exposed Pad | 32-HLQFP (7x7) | 4mA | ||
|
|
|
Texas Instruments |
3,849
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWM PWR DRVR HI-EFF 32-HLQFP
|
Tray | - | Thermoelectric Cooler | -40°C ~ 85°C | 32-LQFP Exposed Pad | 32-HLQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
2,600
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | Processor | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
6,749
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
Texas Instruments |
4,498
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWM PWR DRVR HI-EFF 32-HLQFP
|
Tray | - | Thermoelectric Cooler | -40°C ~ 85°C | 32-LQFP Exposed Pad | 32-HLQFP (7x7) | 500μA | ||
|
|
|
NXP USA Inc. |
815
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | Processor | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
1,897
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
857
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
1,747
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
290
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
400
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | i.MX Processors | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
244
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT I.MX7 6LDO QFN 48
|
Tray | - | Processor | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
260
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tray | - | Processor | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tray | - | Processor | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
260
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC POWER MANAGEMENT 48QFN
|
Tray | - | Processor | -40°C ~ 105°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
489
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tray | - | i.MX Processors | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
260
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tray | - | i.MX Processors | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - | ||
|
|
|
NXP USA Inc. |
245
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tray | - | i.MX Processors | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | - |
