- Packaging：
-
- Operating Temperature：
-
- Ausgewählte Bedingungen:
Entdecken Sie 132 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | |
|
|
|
NXP USA Inc. |
195
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
238
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
160
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
240
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FS6500
|
Tray | -40°C ~ 150°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
150
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
240
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
218
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 150°C (TA) | ||
|
|
|
NXP USA Inc. |
123
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
144
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP，LINEAR 0.5A V
|
Tray | -40°C ~ 150°C (TA) | ||
|
|
|
NXP USA Inc. |
180
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SBC，DCDC 1.5A VCORE FS1B CAN,15
|
Tray | -40°C ~ 150°C (TA) | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | -40°C ~ 125°C (TA) | ||
|
|
|
NXP USA Inc. |
9
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -40°C ~ 125°C (TA) |
