- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Current - Supply:
-
- Ausgewählte Bedingungen:
Entdecken Sie 194 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Current - Supply | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Current - Supply | ||
NXP USA Inc. |
195
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
1,250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SYSTEM BASIS CHIP 32LQFP
|
Tray | 5.5 V ~ 27 V | -40°C ~ 125°C | 32-LQFP | 32-LQFP (7x7) | 4.5mA | ||||
NXP USA Inc. |
1,250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SYSTEM BASIS CHIP 32LQFP
|
Tray | 5.5 V ~ 27 V | -40°C ~ 125°C | 32-LQFP | 32-LQFP (7x7) | 4.5mA | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
Tray | 5.5 V ~ 18 V | -40°C ~ 85°C | 32-LQFP | 32-LQFP (7x7) | 4.5mA | ||||
NXP USA Inc. |
1,250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SYSTEM BASIS CHIP 32LQFP
|
Tray | 5.5 V ~ 27 V | -40°C ~ 125°C | 32-LQFP | 32-LQFP (7x7) | 4.5mA | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
238
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
160
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
240
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FS6500
|
Tray | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
150
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
240
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
218
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
123
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
144
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP,LINEAR 0.5A V
|
Tray | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - |