Entdecken Sie 194 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Packaging Voltage - Supply Operating Temperature Package / Case Supplier Device Package Current - Supply
MC33FS6522LAE
NXP USA Inc.
195
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33910G5AC
NXP USA Inc.
1,250
3 tage
-
MOQ: 1  MPQ: 1
IC SYSTEM BASIS CHIP 32LQFP
Tray 5.5 V ~ 27 V -40°C ~ 125°C 32-LQFP 32-LQFP (7x7) 4.5mA
MC33911BAC
NXP USA Inc.
1,250
3 tage
-
MOQ: 1  MPQ: 1
IC SYSTEM BASIS CHIP 32LQFP
Tray 5.5 V ~ 27 V -40°C ~ 125°C 32-LQFP 32-LQFP (7x7) 4.5mA
MC34912G5AC
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
IC SYSTEM BASIS CHIP LIN 32-LQFP
Tray 5.5 V ~ 18 V -40°C ~ 85°C 32-LQFP 32-LQFP (7x7) 4.5mA
MC33912G5AC
NXP USA Inc.
1,250
3 tage
-
MOQ: 1  MPQ: 1
IC SYSTEM BASIS CHIP 32LQFP
Tray 5.5 V ~ 27 V -40°C ~ 125°C 32-LQFP 32-LQFP (7x7) 4.5mA
MC33FS6500NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6510NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 1.5A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6520NAE
NXP USA Inc.
238
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS4500CAE
NXP USA Inc.
160
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6500CAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6500LAE
NXP USA Inc.
240
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6520CAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC35FS6500NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
FS6500
Tray -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6521NAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6502CAE
NXP USA Inc.
150
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS4502LAE
NXP USA Inc.
240
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP LINEAR 0.5A V
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC35FS6500CAE
NXP USA Inc.
218
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6502LAE
NXP USA Inc.
123
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 0.8A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC33FS6523CAE
NXP USA Inc.
144
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP DCDC 2.2A VCO
Tray -1.0 V ~ 40 V -40°C ~ 125°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -
MC35FS4503CAE
NXP USA Inc.
250
3 tage
-
MOQ: 1  MPQ: 1
SYSTEM BASIS CHIP,LINEAR 0.5A V
Tray -1.0 V ~ 40 V -40°C ~ 150°C (TA) 48-LQFP Exposed Pad 48-LQFP (7x7) -