- Packaging:
-
- Applications:
-
- Package / Case:
-
- Supplier Device Package:
-
- Ausgewählte Bedingungen:
Entdecken Sie 14 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Applications | Package / Case | Supplier Device Package | Current - Supply | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Applications | Package / Case | Supplier Device Package | Current - Supply | ||
NXP USA Inc. |
361
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
Tray | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
4,000
|
3 tage |
-
|
MOQ: 4000 MPQ: 1
|
PF4210
|
Tape & Reel (TR) | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
4,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
Cut Tape (CT) | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
4,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
- | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
250
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
Tray | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
PF4210
|
Tape & Reel (TR) | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
3,764
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
Cut Tape (CT) | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
3,764
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
PF4210
|
- | Audio,Video | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | - | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tape & Reel (TR) | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tape & Reel (TR) | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | ||||
NXP USA Inc. |
1,044
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 48QFN
|
Tray | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | ||||
NXP USA Inc. |
1,040
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 48QFN
|
Tray | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | ||||
NXP USA Inc. |
1,035
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 48QFN
|
Tray | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tape & Reel (TR) | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA |