- Packaging：
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- Series：
-
- Applications：
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- Package / Case：
-
- Supplier Device Package：
-
- Current - Supply：
-
- Ausgewählte Bedingungen:
Entdecken Sie 30 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Applications | Package / Case | Supplier Device Package | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Applications | Package / Case | Supplier Device Package | Current - Supply | |
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
REGULATOR BUCK QUAD WITH UP TO
|
Tape & Reel (TR) | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | 250μA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
REGULATOR BUCK QUAD WITH UP TO
|
Tape & Reel (TR) | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | 250μA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
REGULATOR BUCK QUAD WITH UP TO
|
Tape & Reel (TR) | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | 250μA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
REGULATOR BUCK QUAD WITH UP TO
|
Tape & Reel (TR) | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | 250μA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
REGULATOR BUCK QUAD WITH UP TO
|
Tape & Reel (TR) | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | 250μA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC REG 9OUT BUCK/LDO 56QFN
|
Tray | Automotive，AEC-Q100 | QorlQ LS1/T1 Communications Processors | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) | 250μA | ||
|
|
NXP USA Inc. |
1,044
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 48QFN
|
Tray | - | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | |||
|
|
NXP USA Inc. |
1,040
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 48QFN
|
Tray | - | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | |||
|
|
NXP USA Inc. |
1,035
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC REG 9OUT BUCK/LDO 48QFN
|
Tray | - | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA | |||
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
POWER MANAGEMENT IC I.MX7 PRE-
|
Tape & Reel (TR) | - | LS1 Communication Processors | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 450μA |
