- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
-
- Supplier Device Package：
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- Mounting Type：
-
- Features：
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- Output Type：
-
- Number of I/O：
-
- Clock Frequency：
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- Current - Output Source/Sink：
-
- Ausgewählte Bedingungen:
Entdecken Sie 52 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | |
|
|
|
NXP USA Inc. |
2,500
|
3 tage |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,111
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,111
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
Maxim Integrated |
5,222
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
Tube | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 8 (Output Only) | 400kHz | 25mA | ||
|
|
|
Maxim Integrated |
639
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 9B 16TSSOP
|
Tube | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | EEPROM，POR | Open Drain | 9 | 400kHz | 12mA | ||
|
|
|
Maxim Integrated |
203
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tube | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 25mA | ||
|
|
|
NXP USA Inc. |
6,000
|
3 tage |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,357
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,357
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Tape & Reel (TR) | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - | ||
|
|
|
NXP USA Inc. |
2,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Cut Tape (CT) | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - | ||
|
|
|
NXP USA Inc. |
2,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
- | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,626
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,626
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,497
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,497
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA，25mA | ||
|
|
|
Maxim Integrated |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tape & Reel (TR) | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 25mA | ||
|
|
|
Maxim Integrated |
422
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Cut Tape (CT) | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 8 | 400kHz | 25mA |
