- Applications：
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- Operating Temperature：
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- Package / Case：
-
- Supplier Device Package：
-
- Features：
-
- Multiplexer/Demultiplexer Circuit：
-
- On-State Resistance (Max)：
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- Voltage - Supply, Single (V+)：
-
- Ausgewählte Bedingungen:
Entdecken Sie 38 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Applications | Number of Channels | Operating Temperature | Package / Case | Supplier Device Package | Features | Multiplexer/Demultiplexer Circuit | Switch Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Applications | Number of Channels | Operating Temperature | Package / Case | Supplier Device Package | Features | Multiplexer/Demultiplexer Circuit | Switch Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | |
|
|
|
Texas Instruments |
2,000
|
3 tage |
-
|
MOQ: 2000 MPQ: 1
|
IC ETHERNET SWITCH 16X8 56WQFN
|
Tape & Reel (TR) | Networking | 11 | -40°C ~ 85°C (TA) | 56-WFQFN Exposed Pad | 56-WQFN-EP (5x11) | 10/100,1000 Base-T，LVDS，LVPECL | 0.08402777777777777 | SPDT | 8 Ohm | 3 V ~ 3.6 V | ||
|
|
|
Texas Instruments |
5,076
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC ETHERNET SWITCH 16X8 56WQFN
|
Cut Tape (CT) | Networking | 11 | -40°C ~ 85°C (TA) | 56-WFQFN Exposed Pad | 56-WQFN-EP (5x11) | 10/100,1000 Base-T，LVDS，LVPECL | 0.08402777777777777 | SPDT | 8 Ohm | 3 V ~ 3.6 V | ||
|
|
|
Maxim Integrated |
237
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC ANLG PASSIVE SW USB 42TQFN
|
Tray | Video | - | -40°C ~ 85°C (TA) | 42-WFQFN Exposed Pad | 42-TQFN-EP (3.5x9) | USB 2.0，USB 3.0 | - | - | 10 Ohm | 3 V ~ 5.5 V | ||
|
|
|
NXP USA Inc. |
4,000
|
3 tage |
-
|
MOQ: 4000 MPQ: 1
|
IC USB SWITCH DPDT XQFN10
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.4x1.8) | Break-Before-Make，USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
12,809
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT XQFN10
|
Cut Tape (CT) | USB | 1 | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.4x1.8) | Break-Before-Make，USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
12,809
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT XQFN10
|
- | USB | 1 | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.4x1.8) | Break-Before-Make，USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC USB 2.0 SWITCH HS 10XQFN
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.3x1.6) | Break-Before-Make，USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
3,207
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10XQFN
|
Cut Tape (CT) | USB | 1 | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.3x1.6) | Break-Before-Make，USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
3,207
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10XQFN
|
- | USB | 1 | -40°C ~ 125°C (TA) | 10-XFQFN | 10-XQFN (1.3x1.6) | Break-Before-Make，USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||
|
|
|
Maxim Integrated |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC AUD SWITCH USB 2.0 HS 10UTQFN
|
Tape & Reel (TR) | Audio，USB | 2 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | 2:1，2:2 | - | 5 Ohm | 2.7 V ~ 5 V | ||
|
|
|
Maxim Integrated |
1,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC AUD SWITCH USB 2.0 HS 10UTQFN
|
Cut Tape (CT) | Audio，USB | 2 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | 2:1，2:2 | - | 5 Ohm | 2.7 V ~ 5 V | ||
|
|
|
Maxim Integrated |
1,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC AUD SWITCH USB 2.0 HS 10UTQFN
|
- | Audio，USB | 2 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | 2:1，2:2 | - | 5 Ohm | 2.7 V ~ 5 V | ||
|
|
|
Maxim Integrated |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC USB SWITCH DPDT 10UTQFN
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | - | DPDT | 10 Ohm | 2.8 V ~ 5.5 V | ||
|
|
|
Maxim Integrated |
1,213
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10UTQFN
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | - | DPDT | 10 Ohm | 2.8 V ~ 5.5 V | ||
|
|
|
Maxim Integrated |
1,213
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10UTQFN
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | - | DPDT | 10 Ohm | 2.8 V ~ 5.5 V | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC SWITCH TPDT DIFF XQFN24
|
Tape & Reel (TR) | MIPI | 1 | -40°C ~ 85°C (TA) | 24-XFQFN | 24-XQFN (2.5x3.4) | Break-Before-Make | - | 3PDT | 14 Ohm | 2.65 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
712
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SWITCH TPDT DIFF XQFN24
|
Cut Tape (CT) | MIPI | 1 | -40°C ~ 85°C (TA) | 24-XFQFN | 24-XQFN (2.5x3.4) | Break-Before-Make | - | 3PDT | 14 Ohm | 2.65 V ~ 4.3 V | ||
|
|
|
NXP USA Inc. |
712
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SWITCH TPDT DIFF XQFN24
|
- | MIPI | 1 | -40°C ~ 85°C (TA) | 24-XFQFN | 24-XQFN (2.5x3.4) | Break-Before-Make | - | 3PDT | 14 Ohm | 2.65 V ~ 4.3 V | ||
|
|
|
Texas Instruments |
Anfrage
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC ETHERNET SWITCH 16X8 56WQFN
|
Tape & Reel (TR) | Networking | 11 | -40°C ~ 85°C (TA) | 56-WFQFN Exposed Pad | 56-WQFN-EP (5x11) | 10/100,1000 Base-T，LVDS，LVPECL | 0.08402777777777777 | SPDT | 8 Ohm | 3 V ~ 3.6 V | ||
|
|
|
Maxim Integrated |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC USB SWITCH DPDT 10UTQFN
|
Tape & Reel (TR) | Audio，USB | 2 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (1.4x1.8) | USB 2.0 | 2:1，2:2 | - | 5 Ohm | 2.7 V ~ 5 V |
