- Packaging:
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- Operating Temperature:
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- Package / Case:
-
- Supplier Device Package:
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- Features:
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- -3db Bandwidth:
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- Multiplexer/Demultiplexer Circuit:
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- Voltage - Supply, Single (V+):
-
- Ausgewählte Bedingungen:
Entdecken Sie 20 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Features | -3db Bandwidth | Multiplexer/Demultiplexer Circuit | Voltage - Supply, Single (V+) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Features | -3db Bandwidth | Multiplexer/Demultiplexer Circuit | Voltage - Supply, Single (V+) | ||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC MUX/DEMUX SWITCH CHIP 24HVQFN
|
Tape & Reel (TR) | -20°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) | - | 10GHz | 3:1,2:1 | 3 V ~ 3.6 V | ||||
NXP USA Inc. |
4,948
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX SWITCH CHIP 24HVQFN
|
Cut Tape (CT) | -20°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) | - | 10GHz | 3:1,2:1 | 3 V ~ 3.6 V | ||||
NXP USA Inc. |
4,948
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX SWITCH CHIP 24HVQFN
|
- | -20°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) | - | 10GHz | 3:1,2:1 | 3 V ~ 3.6 V | ||||
Diodes Incorporated |
930
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:4 40TQFN
|
Tray | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MUX/DEMUX 2:1 12GBPS 40TQFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MUX/DEMUX 2:1 12GBPS 42TQFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC MUX/DEMUX 2:1 PCI 24HVQFN
|
Tape & Reel (TR) | 0°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) | - | 5GHz | 0.08402777777777777 | 3 V ~ 3.6 V | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:1 PCI 24HVQFN
|
Cut Tape (CT) | 0°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) | - | 5GHz | 0.08402777777777777 | 3 V ~ 3.6 V | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:1 PCI 24HVQFN
|
- | 0°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-HVQFN (3x3) | - | 5GHz | 0.08402777777777777 | 3 V ~ 3.6 V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:4 42TQFN
|
Tray | -40°C ~ 85°C (TA) | 42-VFQFN Exposed Pad | 42-TQFN (9x3.5) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MUX/DEMUX 12GBPS 18X2QFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 18-XFQFN Exposed Pad | 18-X2QFN (2x2) | Bi-Directional | 10.6GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
3,030
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:1 18X2QFN
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 18-XFQFN Exposed Pad | 18-QFN (2x2) | Bi-Directional | 10.6GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
3,030
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:1 18X2QFN
|
- | -40°C ~ 85°C (TA) | 18-XFQFN Exposed Pad | 18-QFN (2x2) | Bi-Directional | 10.6GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MUX/DEMUX 2:4 20TQFN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 20-VFQFN Exposed Pad | 20-QFN (2.5x4.5) | Bi-Directional | 10.6GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
4,398
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:4 20TQFN
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 20-VFQFN Exposed Pad | 20-QFN (2.5x4.5) | Bi-Directional | 10.6GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
4,398
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MUX/DEMUX 2:4 20TQFN
|
- | -40°C ~ 85°C (TA) | 20-VFQFN Exposed Pad | 20-QFN (2.5x4.5) | Bi-Directional | 10.6GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MUX/DEMUX 2:1 12GBPS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3500 MPQ: 1
|
IC MUX/DEMUX 2:1 12GBPS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 490 MPQ: 1
|
IC MUX/DEMUX 2:1 12GBPS
|
Tray | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V | ||||
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 400 MPQ: 1
|
IC MUX/DEMUX 2:1 12GBPS
|
Tray | -40°C ~ 85°C (TA) | 40-WFQFN Exposed Pad | 40-TQFN (3x6) | Bi-Directional | 11.3GHz | 0.08402777777777777 | 3.3V |