- Series:
-
- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Speed:
-
- Co-Processors/DSP:
-
- RAM Controllers:
-
- SATA:
-
- Security Features:
-
- Ausgewählte Bedingungen:
Entdecken Sie 8 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | SATA | USB | Security Features | ||
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
|
QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
|
QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
|
QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
|
QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - |