- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- USB：
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- Ausgewählte Bedingungen:
Entdecken Sie 217 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
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NXP USA Inc. |
Anfrage
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- |
-
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MOQ: 260 MPQ: 1
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IC MPU I.MC6UL 528MHZ 272BGA
|
Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Anfrage
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- |
-
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MOQ: 152 MPQ: 1
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IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Anfrage
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- |
-
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MOQ: 90 MPQ: 1
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IC MCU 32BIT ROMLESS 364MAPBGA
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Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | ||
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NXP USA Inc. |
Anfrage
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- |
-
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MOQ: 152 MPQ: 1
|
I.MX 32-BIT MPU，ARM CORTEX-A7 C
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Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 152 MPQ: 1
|
I.MX 6ULL 900 MHZ CONSUMER W/O E
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 900MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 152 MPQ: 1
|
I.MX 32-BIT MPU ARM CORTEX-A7 C
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
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Microchip Technology |
2,561
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB ROM 217BGA
|
Tray | SAM9X | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，2.5V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2，DDR，SDR，SRAM | No | - | USB 2.0 (3) | - | |||
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NXP USA Inc. |
260
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 272BGA
|
Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
90
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
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Microchip Technology |
Anfrage
|
- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 64KB ROM 217BGA
|
Tape & Reel (TR) | SAM9X | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，2.5V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2，DDR，SDR，SRAM | No | - | USB 2.0 (3) | - | |||
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Microchip Technology |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB ROM 217BGA
|
Cut Tape (CT) | SAM9X | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，2.5V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2，DDR，SDR，SRAM | No | - | USB 2.0 (3) | - | |||
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Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB ROM 217BGA
|
- | SAM9X | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，2.5V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2，DDR，SDR，SRAM | No | - | USB 2.0 (3) | - | |||
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NXP USA Inc. |
1,000
|
3 tage |
-
|
MOQ: 1000 MPQ: 1
|
CORTEX- M4 PRIMARY CORE CORTEX
|
Tape & Reel (TR) | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，133MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
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NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 500MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | ||
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 32-BIT MPU ARM CORTEX-A7 C
|
Tape & Reel (TR) | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | |||
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NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 260 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 272BGA
|
Tray | i.MX6UL | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 272BGA
|
Tray | i.MX6UL | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
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NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 260 MPQ: 1
|
IC MPU I.MX6UL 272BGA
|
Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 500 MPQ: 1
|
VYBRID R 32-BIT MPU ARM CORTEX-
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Tape & Reel (TR) | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 266MHz，133MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG |
