- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- USB：
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- Ausgewählte Bedingungen:
Entdecken Sie 217 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
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NXP USA Inc. |
Anfrage
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- |
-
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MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，133MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，133MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
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NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，133MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
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IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
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MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 200MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 200MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
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IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
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MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 233MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 233MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
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IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
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MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 233MHZ 416BGA
|
Tray | Interprise | -40°C ~ 85°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 233MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
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IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
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MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 266MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 266MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
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IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 266MHZ 416BGA
|
Tray | Interprise | -40°C ~ 85°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 266MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
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IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
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MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 300MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 300MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 1000 MPQ: 1
|
MVF50NS152CMK50R
|
Tape & Reel (TR) | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | |||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 90 MPQ: 1
|
VYBRID F 32-BIT MPU ARM CORTEX-
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | |||
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|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 200MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 200MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 233MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 233MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 233MHZ 416BGA
|
Tray | Interprise | -40°C ~ 85°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 233MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 266MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 266MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 266MHZ 416BGA
|
Tray | Interprise | -40°C ~ 85°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 266MHz | 1 Core，32-Bit | - | DDR | No | - | - | - | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU INTERPRISE 300MHZ 416BGA
|
Tray | Interprise | 0°C ~ 70°C (TA) | 416-BGA | 416-PBGA (27x27) | MIPS32 | 3.3V | 300MHz | 1 Core，32-Bit | - | DDR | No | - | - | - |
