- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Voltage - I/O:
-
- Number of Cores/Bus Width:
-
- Co-Processors/DSP:
-
- Ausgewählte Bedingungen:
Entdecken Sie 14 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | Graphics Acceleration | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | Graphics Acceleration | ||
Advantech Corp |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XEON 1.7G 11M 3647P 8C 3106 -BRO
|
Bulk | Skylake | - | 3647-LGA Module | 3647-FCLGA (76x56.5) | Xeon Bronze 3106 | - | 8 Core,64-Bit | - | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCLGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA,FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCLGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA,FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCLGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA,FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.7GHZ 360FCCLGA
|
Tray | MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA,FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1 Core,32-Bit | Multimedia; SIMD | No | ||||
Advantech Corp |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XEON 1.7G 20M 2011P 8CORE 85W
|
Tray | Broadwell | - | 2011-LGA,FC | 2011-LGA | Xeon E5-2609 v4 | - | 8 Core,64-Bit | - | - |