Entdecken Sie 56 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Packaging Series Operating Temperature Package / Case Supplier Device Package Core Processor Voltage - I/O Speed RAM Controllers Graphics Acceleration Display & Interface Controllers Security Features
MCIMX6X3CVO08AB
NXP USA Inc.
265
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 400MAPBGA
Tray i.MX6SX -40°C ~ 105°C (TA) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X3EVK10AB
NXP USA Inc.
1,520
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 1GHZ 400MAPBGA
Tray i.MX6SX -20°C ~ 105°C (TJ) 400-LFBGA 400-MAPBGA (14x14) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,1GHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X4CVM08AB
NXP USA Inc.
1,424
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 529MAPBGA
Tray i.MX6SX -40°C ~ 105°C (TA) 529-LFBGA 529-MAPBGA (19x19) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD,LVDS A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X4AVM08AB
NXP USA Inc.
564
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 529MAPBGA
Tray i.MX6SX -40°C ~ 125°C (TJ) 529-LFBGA 529-MAPBGA (19x19) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD,LVDS A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X4EVM10AB
NXP USA Inc.
166
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 1GHZ 529MAPBGA
Tray i.MX6SX -20°C ~ 105°C (TJ) 529-LFBGA 529-MAPBGA (19x19) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,1GHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD,LVDS A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X3EVO10AB
NXP USA Inc.
155
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 1GHZ 400MAPBGA
Tray i.MX6SX -20°C ~ 105°C (TJ) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,1GHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X1AVO08AB
NXP USA Inc.
120
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 400MAPBGA
Tray i.MX6SX -40°C ~ 125°C (TJ) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 No Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X2AVN08AB
NXP USA Inc.
171
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 400MAPBGA
Tray i.MX6SX -40°C ~ 125°C (TJ) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X1CVK08AB
NXP USA Inc.
222
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 400MAPBGA
Tray i.MX6SX -40°C ~ 105°C (TA) 400-LFBGA 400-MAPBGA (14x14) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 No Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X1AVK08AB
NXP USA Inc.
126
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 400MAPBGA
Tray i.MX6SX -40°C ~ 125°C (TJ) 400-LFBGA 400-MAPBGA (14x14) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 No Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX7D3DVK10SC
NXP USA Inc.
142
3 tage
-
MOQ: 1  MPQ: 1
NO EPDC,2 ETH,NO CAN,2 OTG 1
Tray i.MX7D 0°C ~ 95°C (TJ) 488-TFBGA 488-FBGA (12x12) ARM® Cortex®-A7,ARM® Cortex®-M4 1.8V,3.3V 1.0GHz LPDDR2,LPDDR3,DDR3,DDR3L No Keypad,LCD,MIPI A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
MCIMX7D7DVK10SC
NXP USA Inc.
283
3 tage
-
MOQ: 1  MPQ: 1
EPDC,2 ETH,CAN,2 OTG 1 HSIC,
Tray i.MX7D 0°C ~ 95°C (TJ) 488-TFBGA 488-FBGA (12x12) ARM® Cortex®-A7,ARM® Cortex®-M4 1.8V,3.3V 1.0GHz LPDDR2,LPDDR3,DDR3,DDR3L No Keypad,LCD,MIPI A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
MCIMX7D7DVM10SC
NXP USA Inc.
524
3 tage
-
MOQ: 1  MPQ: 1
EPDC,2 ETH,CAN,2 OTG 1 HSIC,
Tray i.MX7D 0°C ~ 95°C (TJ) 541-LFBGA 541-MAPBGA (19x19) ARM® Cortex®-A7,ARM® Cortex®-M4 1.8V,3.3V 1.0GHz LPDDR2,LPDDR3,DDR3,DDR3L No Keypad,LCD,MIPI A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
MCIMX6X1CVO08AB
NXP USA Inc.
89
3 tage
-
MOQ: 1  MPQ: 1
IC MPU 32BIT I.MX6 800MHZ 400BGA
Tray i.MX6SX -40°C ~ 105°C (TA) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 No Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X3EVN10AB
NXP USA Inc.
90
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 1GHZ 400MAPBGA
Tray i.MX6SX -20°C ~ 105°C (TJ) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,1GHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X3CVN08AB
NXP USA Inc.
60
3 tage
-
MOQ: 1  MPQ: 1
IC MPU I.MX6SX 800MHZ 400MAPBGA
Tray i.MX6SX -40°C ~ 105°C (TA) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX7D3EVK10SC
NXP USA Inc.
40
3 tage
-
MOQ: 1  MPQ: 1
NO EPDC,2 ETH,NO CAN,2 OTG 1
Tray i.MX7D -20°C ~ 105°C (TJ) 488-TFBGA 488-FBGA (12x12) ARM® Cortex®-A7,ARM® Cortex®-M4 1.8V,3.3V 1.0GHz LPDDR2,LPDDR3,DDR3,DDR3L No Keypad,LCD,MIPI A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
MCIMX6X2EVN10AB
NXP USA Inc.
90
3 tage
-
MOQ: 1  MPQ: 1
IC MPU 32BIT I.MX6 800MHZ 400BGA
Tray i.MX6SX -20°C ~ 105°C (TJ) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,1GHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX6X2CVN08AB
NXP USA Inc.
90
3 tage
-
MOQ: 1  MPQ: 1
IC MPU 32BIT I.MX6 800MHZ 400BGA
Tray i.MX6SX -40°C ~ 105°C (TA) 400-LFBGA 400-MAPBGA (17x17) ARM® Cortex®-A9,ARM® Cortex®-M4 1.8V,2.5V,2.8V,3.15V 200MHz,800MHz LPDDR2,LVDDR3,DDR3 Yes Keypad,LCD A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE
MCIMX7D2DVM12SC
NXP USA Inc.
77
3 tage
-
MOQ: 1  MPQ: 1
I.MX 7D 1.2 GHZ 19X19 MAPBGA
Tray i.MX7D 0°C ~ 85°C (TJ) 541-LFBGA 541-MAPBGA (19x19) ARM® Cortex®-A7,ARM® Cortex®-M4 1.8V,3.3V 1.2GHz LPDDR2,LPDDR3,DDR3,DDR3L No Keypad,LCD,MIPI A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS