- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Number of Cores/Bus Width：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ausgewählte Bedingungen:
Entdecken Sie 11 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
|
|
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NXP USA Inc. |
152
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，1 ETH，NO CAN，1 OTG 1
|
i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
672
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，1 ETH，CAN，1 OTG 1 HSI
|
i.MX7S | -20°C ~ 105°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 152 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
i.MX6 | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 1 Core，32-Bit | LPDDR2，DDR3，DDR3L | Electrophoretic，LCD | 10/100 Mbps (1) | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
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NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 152 MPQ: 1
|
NO EPDC，1 ETH，CAN，1 OTG 1 HSI
|
i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 152 MPQ: 1
|
NO EPDC，1 ETH，NO CAN，1 OTG 1
|
i.MX7S | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
I.MX 7SOLO: REV 1.3
|
i.MX7S | -20°C ~ 105°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 152 MPQ: 1
|
I.MX 6ULL 800 MHZ INDUSTRIAL
|
i.MX6 | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 1 Core，32-Bit | LPDDR2，DDR3，DDR3L | Electrophoretic，LCD | 10/100 Mbps (1) | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | |||
|
|
NXP USA Inc. |
152
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
I.MX 7SOLO: REV 1.3
|
i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 152 MPQ: 1
|
I.MX 7SOLO: REV 1.3
|
i.MX7S | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 152 MPQ: 1
|
I.MX 7SOLO: REV 1.3
|
i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | |||
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 450 MPQ: 1
|
ISP GPU NO CSE800MHZ
|
- | -40°C ~ 125°C (TA) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53，Cortex®-M4 | 1.8V | 4 Core，64-Bit/1 Core，32-Bit | LPDDR2，DDR3，DDR3L | LCD，Video | GbE | - | AES，ARM TZ，Boot，CSE，OCOTP_CTRL，System JTAG |
