- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- USB：
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- Security Features：
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- Ausgewählte Bedingungen:
Entdecken Sie 270 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Renesas Electronics America |
199
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3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 324FBGA
|
Tray | RZ/A1H | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
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|
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Renesas Electronics America |
200
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 324FBGA
|
Tray | RZ/A1H | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
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NXP USA Inc. |
29
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
PRE-QUAL ISP GPU NO CSE1GHZ
|
Tray | - | -40°C ~ 105°C (TA) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53，ARM® Cortex®-M4 | 1.0V，1.8V，3.3V | 1.0GHz，133MHz | 4 Core，64-Bit/1 Core，32-Bit | LPDDR2，DDR3，DDR3L | Yes | APEX2-CL，DCU (2D-ACE)，ISP，MIPICSI2，VIU | 1 Gbps | - | AES，ARM TZ，Boot，CSE，OCOTP_CTRL，System JTAG | ||
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NXP USA Inc. |
283
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
EPDC，2 ETH，CAN，2 OTG 1 HSIC,
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
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|
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NXP USA Inc. |
524
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
EPDC，2 ETH，CAN，2 OTG 1 HSIC,
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
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|
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Renesas Electronics America |
68
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 208LQFP
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 208-LQFP | 208-LQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
|
|
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NXP USA Inc. |
89
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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Renesas Electronics America |
29
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LQFP
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 256-LQFP | 256-LQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
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Renesas Electronics America |
43
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 324FBGA
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
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Renesas Electronics America |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LFBGA
|
Tray | RZ/A1H | -40°C ~ 85°C (TA) | 256-LFBGA | 256-LFBGA (11x11) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
Renesas Electronics America |
85
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFBGA
|
Tray | RZ/A1LC | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
|
|
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Renesas Electronics America |
75
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176BGA
|
Tray | RZ/A1LU | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
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|
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Renesas Electronics America |
58
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176QFP
|
Tray | RZ/A1LU | -40°C ~ 85°C (TA) | 176-LQFP | 176-LFQFP (24x24) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
Renesas Electronics America |
48
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 208LFQFP
|
Tray | RZ/A1LU | -40°C ~ 85°C (TA) | 208-LQFP | 208-LFQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
Renesas Electronics America |
18
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 208LFQFP
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 208-LQFP | 208-LFQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
|
|
|
Renesas Electronics America |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LFBGA
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 256-LFBGA | 256-LFBGA (11x11) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
90
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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Renesas Electronics America |
48
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LQFP
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 256-LQFP | 256-LQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
Renesas Electronics America |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 324FBGA
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - |
