- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
-
- Voltage - I/O：
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- Speed：
-
- Number of Cores/Bus Width：
-
- RAM Controllers：
-
- Ausgewählte Bedingungen:
Entdecken Sie 24 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | |
|
|
|
NXP USA Inc. |
189
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
150
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
31
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
58
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
5
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
3
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | -40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 2 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | -40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 2 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | 1 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Bulk | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Bulk | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Bulk | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 2 Core，32-Bit | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | 1 Core，32-Bit | DDR3 |
