- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Speed：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ausgewählte Bedingungen:
Entdecken Sie 31 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | SATA | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | SATA | USB | |
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NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE 625BGA
|
0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | - | DDR3 | - | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | ||
|
|
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NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | - | DDR3 | - | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | ||
|
|
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NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
77
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
64
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
78
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
64
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
68
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.2GHz | - | DDR3L，DDR4 | 2D-ACE | SATA 6Gbps (1) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | - | DDR3 | - | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | - | DDR3 | - | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | - | DDR3 | - | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY |
