- Series：
-
- Operating Temperature：
-
- Supplier Device Package：
-
- Core Processor：
-
- Voltage - I/O：
-
- Speed：
-
- Co-Processors/DSP：
-
- RAM Controllers：
-
Entdecken Sie 50 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | USB | Security Features | |
|
|
|
NXP USA Inc. |
1,520
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tray | i.MX28 | -20°C ~ 70°C (TA) | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | Data; DCP | LVDDR，LVDDR2，DDR2 | No | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
|
|
|
NXP USA Inc. |
545
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tray | i.MX28 | -40°C ~ 85°C (TA) | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | Data; DCP | LVDDR，LVDDR2，DDR2 | No | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tape & Reel (TR) | i.MX28 | -20°C ~ 70°C (TA) | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | Data; DCP | LVDDR，LVDDR2，DDR2 | No | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
|
|
|
STMicroelectronics |
Anfrage
|
- |
-
|
MOQ: 756 MPQ: 1
|
IC MPU SPEAR 333MHZ 289LFBGA
|
Tray | SPEAr | -40°C ~ 85°C (TC) | 289-LFBGA | ARM926EJ-S | 3.3V | 333MHz | Security; C3 | LPDDR，DDR2 | No | USB 2.0 + PHY (3) | Cryptography | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 760 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tray | i.MX28 | -20°C ~ 70°C (TA) | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | Data; DCP | LVDDR，LVDDR2，DDR2 | No | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tape & Reel (TR) | i.MX28 | -40°C ~ 85°C (TA) | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | Data; DCP | LVDDR，LVDDR2，DDR2 | No | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 760 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tray | i.MX28 | -40°C ~ 85°C (TA) | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | Data; DCP | LVDDR，LVDDR2，DDR2 | No | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
Microchip Technology |
587
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
230
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
243
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN，IND TEMP,MRLC,512MBIT
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
396
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
636
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
636
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
- | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
940
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC |
