- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Ausgewählte Bedingungen:
Entdecken Sie 6 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | ||
NXP USA Inc. |
3,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
-25°C ~ 85°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (2.06x2.02) | ||||
NXP USA Inc. |
6,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
-25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||||
NXP USA Inc. |
3,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
-40°C ~ 90°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (2.06x2.02) | ||||
NXP USA Inc. |
5,732
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
-40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||||
NXP USA Inc. |
5,999
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
-40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||||
NXP USA Inc. |
9
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
-25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) |