- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Ausgewählte Bedingungen:
Entdecken Sie 24 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Xilinx Inc. |
35
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
24
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 100°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
3
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
3
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 85°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 85°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 85°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 85°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0.880 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
0.880 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
0.880 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
0.922 V ~ 0.979 V | 0°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
0.880 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU040-2FBVA676I
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU040-2FBVA900I
|
0.922 V ~ 0.979 V | -40°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0.970 V ~ 1.030 V | 0°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 |