- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
Entdecken Sie 41 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Intel |
167
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | ||||
Intel |
1,000
|
3 tage |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
1,274
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
1,274
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
602
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | ||||
Intel |
221
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | ||||
Intel |
496
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | ||||
Intel |
111
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
-40°C ~ 100°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | ||||
Intel |
1,362
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | ||||
Intel |
199
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | ||||
Intel |
210
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 178 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 178 | ||||
Intel |
118
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 250 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 250 | ||||
Intel |
113
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 246 I/O 324UBGA
|
-40°C ~ 100°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 246 | ||||
Intel |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
0°C ~ 85°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
728
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
0°C ~ 85°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
728
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
0°C ~ 85°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
0°C ~ 85°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
857
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
0°C ~ 85°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
857
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
0°C ~ 85°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 | ||||
Intel |
Anfrage
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 56 I/O 81WLCSP
|
-40°C ~ 100°C (TJ) | 81-UFBGA,WLCSP | 81-VBGA,WLCSP (4.5x4.4) | 56 |