Package / Case:
Supplier Device Package:
Number of I/O:
Entdecken Sie 8 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Operating Temperature Package / Case Supplier Device Package Number of I/O
EP1AGX35CF484C6N
Intel
Anfrage
-
-
MOQ: 60  MPQ: 1
IC FPGA 230 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BBGA 484-FBGA (23x23) 230
EP1AGX35CF484C6
Intel
Anfrage
-
-
MOQ: 60  MPQ: 1
IC FPGA 230 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BBGA 484-FBGA (23x23) 230
EP1AGX35CF484I6N
Intel
Anfrage
-
-
MOQ: 60  MPQ: 1
IC FPGA 230 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BBGA 484-FBGA (23x23) 230
EP1AGX35CF484I6
Intel
Anfrage
-
-
MOQ: 60  MPQ: 1
IC FPGA 230 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BBGA 484-FBGA (23x23) 230
EP1AGX35DF780C6N
Intel
Anfrage
-
-
MOQ: 36  MPQ: 1
IC FPGA 341 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BBGA 780-FBGA (29x29) 341
EP1AGX35DF780C6
Intel
Anfrage
-
-
MOQ: 36  MPQ: 1
IC FPGA 341 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BBGA 780-FBGA (29x29) 341
EP1AGX35DF780I6N
Intel
Anfrage
-
-
MOQ: 36  MPQ: 1
IC FPGA 341 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BBGA 780-FBGA (29x29) 341
EP1AGX35DF780I6
Intel
Anfrage
-
-
MOQ: 36  MPQ: 1
IC FPGA 341 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BBGA 780-FBGA (29x29) 341