- Voltage - Supply:
-
- Operating Temperature:
-
- Supplier Device Package:
-
- Mounting Type:
-
- Ausgewählte Bedingungen:
Entdecken Sie 20 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Number of I/O | ||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 228 I/O 256CQFP
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 228 I/O 256CQFP
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TJ) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 228 I/O 256CQFP
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 228 I/O 256CQFP
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 228 I/O 256CQFP
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 228 I/O 256CQFP
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TJ) | 256-BFCQFP with Tie Bar | 256-CQFP (75x75) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC FPGA 228 I/O 257CPGA
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 257-BCPGA | 257-CPGA (50x50) | Through Hole | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC FPGA 228 I/O 257CPGA
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | 257-BCPGA | 257-CPGA (50x50) | Through Hole | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC FPGA 228 I/O 257CPGA
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 257-BCPGA | 257-CPGA (50x50) | Through Hole | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC FPGA 228 I/O 257CPGA
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TJ) | 257-BCPGA | 257-CPGA (50x50) | Through Hole | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC FPGA 228 I/O 257CPGA
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | 257-BCPGA | 257-CPGA (50x50) | Through Hole | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC FPGA 228 I/O 257CPGA
|
4.5 V ~ 5.5 V | -55°C ~ 125°C (TJ) | 257-BCPGA | 257-CPGA (50x50) | Through Hole | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 175 I/O 208QFP
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 208-BFQFP Exposed Pad | 208-RQFP (28x28) | Surface Mount | 175 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 228 I/O 313BGA
|
3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 313-BBGA | 313-PBGA (35x35) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 175 I/O 208QFP
|
4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | 208-BFQFP Exposed Pad | 208-RQFP (28x28) | Surface Mount | 175 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 175 I/O 208QFP
|
4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | 208-BFQFP Exposed Pad | 208-RQFP (28x28) | Surface Mount | 175 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 228 I/O 313BGA
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 313-BBGA | 313-PBGA (35x35) | Surface Mount | 228 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 175 I/O 208QFP
|
3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 208-BFQFP Exposed Pad | 208-RQFP (28x28) | Surface Mount | 175 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 175 I/O 208QFP
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 208-BFQFP Exposed Pad | 208-RQFP (28x28) | Surface Mount | 175 | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC FPGA 228 I/O 313BGA
|
4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | 313-BBGA | 313-PBGA (35x35) | Surface Mount | 228 |