Entdecken Sie 7 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Operating Temperature Package / Case Supplier Device Package
XC2V3000-4FGG676C
Xilinx Inc.
Anfrage
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-
MOQ: 2  MPQ: 1
IC FPGA 484 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC2V3000-5FGG676C
Xilinx Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
IC FPGA 484 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC2V3000-4FGG676I
Xilinx Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
IC FPGA 484 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27)
XC2V3000-5FGG676I
Xilinx Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
IC FPGA 484 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27)
XC2V3000-6FGG676C
Xilinx Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
IC FPGA 484 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC2V3000-4FG676I
Xilinx Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
IC FPGA 484 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC2V3000-5FG676I
Xilinx Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
IC FPGA 484 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)