- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Ausgewählte Bedingungen:
Entdecken Sie 25 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 700 I/O 900FBGA
|
0°C ~ 85°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 700 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 700 I/O 900FBGA
|
-40°C ~ 100°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 700 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 700 I/O 900FBGA
|
0°C ~ 85°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 700 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 700 I/O 900FBGA
|
-40°C ~ 100°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 700 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 700 I/O 900FBGA
|
0°C ~ 85°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 700 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 724 I/O 1156FBGA
|
0°C ~ 85°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 724 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 724 I/O 1156FBGA
|
-40°C ~ 100°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 724 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
0°C ~ 85°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
-40°C ~ 100°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 860FBGA
|
0°C ~ 85°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) | 660 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 860FBGA
|
-40°C ~ 100°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) | 660 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 724 I/O 1156FBGA
|
0°C ~ 85°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 724 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 724 I/O 1156FBGA
|
-40°C ~ 100°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 724 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
0°C ~ 85°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
-40°C ~ 100°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 860FBGA
|
0°C ~ 85°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) | 660 |