- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Ausgewählte Bedingungen:
Entdecken Sie 18 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | |
|
|
|
Intel |
33
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 270 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 270 | ||
|
|
|
Intel |
57
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 393 I/O 672FBGA
|
0°C ~ 85°C (TJ) | 672-BGA | 672-FBGA (27x27) | 393 | ||
|
|
|
Intel |
28
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 393 I/O 672FBGA
|
-40°C ~ 100°C (TJ) | 672-BGA | 672-FBGA (27x27) | 393 | ||
|
|
|
Intel |
4
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 270 I/O 484FBGA
|
-40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 270 | ||
|
|
|
Intel |
25
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 475 I/O 896FBGA
|
-40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | 475 | ||
|
|
|
Intel |
7
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 475 I/O 896FBGA
|
0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) | 475 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 270 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 270 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 270 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 270 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC FPGA 393 I/O 672FBGA
|
0°C ~ 85°C (TJ) | 672-BGA | 672-FBGA (27x27) | 393 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC FPGA 393 I/O 672FBGA
|
0°C ~ 85°C (TJ) | 672-BGA | 672-FBGA (27x27) | 393 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC FPGA 475 I/O 896FBGA
|
0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) | 475 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 270 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 270 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC FPGA 475 I/O 896FBGA
|
0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) | 475 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC FPGA 393 I/O 672FBGA
|
0°C ~ 85°C (TJ) | 672-BGA | 672-FBGA (27x27) | 393 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 270 I/O 484FBGA
|
-40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 270 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC FPGA 475 I/O 896FBGA
|
0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) | 475 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC FPGA 393 I/O 672FBGA
|
-40°C ~ 100°C (TJ) | 672-BGA | 672-FBGA (27x27) | 393 | ||
|
|
|
Intel |
Anfrage
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC FPGA 475 I/O 896FBGA
|
-40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | 475 |
