- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Number of Gates：
-
- Total RAM Bits：
-
- Ausgewählte Bedingungen:
Entdecken Sie 28 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Number of Gates | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|
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|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
-40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 352 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad，Metal | 560-MBGA (42.5x42.5) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 352 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad，Metal | 560-MBGA (42.5x42.5) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
-40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 352 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad，Metal | 560-MBGA (42.5x42.5) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 352 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad，Metal | 560-MBGA (42.5x42.5) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
-40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 352 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad，Metal | 560-MBGA (42.5x42.5) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 352 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad，Metal | 560-MBGA (42.5x42.5) | 52000 | 1936 | 4598 | 61952 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
-40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
-40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
-40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 62000 | 2304 | 5472 | 73728 | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad，Metal | 432-MBGA (40x40) | 85000 | 3136 | 7448 | 100352 |
