Package / Case:
Supplier Device Package:
Entdecken Sie 8 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Operating Temperature Package / Case Supplier Device Package
10CL055YF484I7G
Intel
228
3 tage
-
MOQ: 1  MPQ: 1
IC FPGA 321 I/O 484 FBGA
-40°C ~ 100°C (TJ) 484-FBGA 484-FBGA (23x23)
10CL055YU484C6G
Intel
158
3 tage
-
MOQ: 1  MPQ: 1
IC FPGA 321 I/O 484UBGA
0°C ~ 85°C (TJ) 484-FBGA 484-UBGA (19x19)
10CL055YF484C6G
Intel
115
3 tage
-
MOQ: 1  MPQ: 1
IC FPGA 321 I/O 484 FBGA
0°C ~ 85°C (TJ) 484-FBGA 484-FBGA (23x23)
10CL055YU484I7G
Intel
48
3 tage
-
MOQ: 1  MPQ: 1
IC FPGA 321 I/O 484UBGA
-40°C ~ 100°C (TJ) 484-FBGA 484-UBGA (19x19)
10CL055YU484C8G
Intel
Anfrage
-
-
MOQ: 84  MPQ: 1
484-PIN UBGA
0°C ~ 85°C (TJ) 484-UBGA 484-UBGA (19x19)
10CL055YF484C8G
Intel
Anfrage
-
-
MOQ: 60  MPQ: 1
484-PIN FBGA
0°C ~ 85°C (TJ) 484-FBGA 484-FBGA (23x23)
10CL055ZU484I8G
Intel
Anfrage
-
-
MOQ: 84  MPQ: 1
484-PIN UBGA
-40°C ~ 100°C (TJ) 484-UBGA 484-UBGA (19x19)
10CL055ZF484I8G
Intel
Anfrage
-
-
MOQ: 60  MPQ: 1
484-PIN FBGA
-40°C ~ 100°C (TJ) 484-FBGA 484-FBGA (23x23)