- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Delay Time tpd(1) Max:
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- Voltage Supply - Internal:
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Entdecken Sie 239 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks | Number of Macrocells | Number of Gates | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Delay Time tpd(1) Max | Voltage Supply - Internal | Number of Logic Elements/Blocks | Number of Macrocells | Number of Gates | Number of I/O | ||
Xilinx Inc. |
Anfrage
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- |
-
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MOQ: 90 MPQ: 1
|
IC CPLD 512MC 10.8NS 256BGA
|
Tray | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | 256-LBGA | 256-FTBGA (17x17) | Surface Mount | 10.8ns | 3 V ~ 3.6 V | 32 | 512 | 12000 | 212 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC CPLD 512MC 10.8NS 324BGA
|
Tray | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | 324-BBGA | 324-FBGA (23x23) | Surface Mount | 10.8ns | 3 V ~ 3.6 V | 32 | 512 | 12000 | 260 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC CPLD 512MC 9NS 256BGA
|
Tray | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | 256-LBGA | 256-FTBGA (17x17) | Surface Mount | 9.0ns | 3 V ~ 3.6 V | 32 | 512 | 12000 | 212 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC CPLD 512MC 10.8NS 256BGA
|
Tray | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | 256-LBGA | 256-FTBGA (17x17) | Surface Mount | 10.8ns | 2.7 V ~ 3.6 V | 32 | 512 | 12000 | 212 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
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MOQ: 60 MPQ: 1
|
IC CPLD 512MC 9NS 324BGA
|
Tray | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | 324-BBGA | 324-FBGA (23x23) | Surface Mount | 9.0ns | 3 V ~ 3.6 V | 32 | 512 | 12000 | 260 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC CPLD 512MC 10.8NS 324BGA
|
Tray | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | 324-BBGA | 324-FBGA (23x23) | Surface Mount | 10.8ns | 2.7 V ~ 3.6 V | 32 | 512 | 12000 | 260 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC CPLD 512MC 9NS 256BGA
|
Tray | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | 256-LBGA | 256-FTBGA (17x17) | Surface Mount | 9.0ns | 2.7 V ~ 3.6 V | 32 | 512 | 12000 | 212 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC CPLD 512MC 7NSNS 256BGA
|
Tray | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | 256-LBGA | 256-FTBGA (17x17) | Surface Mount | 7.0ns | 3 V ~ 3.6 V | 32 | 512 | 12000 | 212 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC CPLD 512MC 9NS 324BGA
|
Tray | CoolRunner XPLA3 | -40°C ~ 85°C (TA) | 324-BBGA | 324-FBGA (23x23) | Surface Mount | 9.0ns | 2.7 V ~ 3.6 V | 32 | 512 | 12000 | 260 | ||||
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC CPLD 512MC 7NSNS 324BGA
|
Tray | CoolRunner XPLA3 | 0°C ~ 70°C (TA) | 324-BBGA | 324-FBGA (23x23) | Surface Mount | 7.0ns | 3 V ~ 3.6 V | 32 | 512 | 12000 | 260 | ||||
Microchip Technology |
Anfrage
|
- |
-
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MOQ: 494 MPQ: 1
|
IC CPLD 10MC 15NS 28PLCC
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) | Surface Mount | 15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
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MOQ: 435 MPQ: 1
|
IC CPLD 10MC 15NS 24DIP
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 24-DIP (0.300",7.62mm) | 24-PDIP | Through Hole | 15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 496 MPQ: 1
|
IC CPLD 10MC 15NS 24SOIC
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 24-SOIC (0.295",7.50mm Width) | 24-SO | Surface Mount | 15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
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MOQ: 494 MPQ: 1
|
IC CPLD 10MC 15NS 28PLCC
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) | Surface Mount | 15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 435 MPQ: 1
|
IC CPLD 10MC 15NS 24DIP
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 24-DIP (0.300",7.62mm) | 24-PDIP | Through Hole | 15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 496 MPQ: 1
|
IC CPLD 10MC 15NS 24SOIC
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 24-SOIC (0.295",7.50mm Width) | 24-SO | Surface Mount | 15.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 342 MPQ: 1
|
IC CPLD 10MC 10NS 28PLCC
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) | Surface Mount | 10.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 266 MPQ: 1
|
IC CPLD 10MC 10NS 28PLCC
|
Tube | ATF750C(L) | -40°C ~ 85°C (TA) | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) | Surface Mount | 10.0ns | 4.5 V ~ 5.5 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 315 MPQ: 1
|
IC CPLD 10MC 10NS 24DIP
|
Tube | ATF750C(L) | 0°C ~ 70°C (TA) | 24-DIP (0.300",7.62mm) | 24-PDIP | Through Hole | 10.0ns | 4.75 V ~ 5.25 V | - | 10 | - | 10 | ||||
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 270 MPQ: 1
|
IC CPLD 10MC 10NS 24DIP
|
Tube | ATF750C(L) | -40°C ~ 85°C (TA) | 24-DIP (0.300",7.62mm) | 24-PDIP | Through Hole | 10.0ns | 4.5 V ~ 5.5 V | - | 10 | - | 10 |