- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Features：
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- Memory Size：
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- Voltage - Supply, Battery：
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- Ausgewählte Bedingungen:
Entdecken Sie 53 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Memory Size | Voltage - Supply, Battery | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Memory Size | Voltage - Supply, Battery | |
|
|
|
Microchip Technology |
3,300
|
3 tage |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
5,301
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Cut Tape (CT) | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
5,301
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
- | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
6,059
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SOIC
|
Tube | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
3,465
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TSSOP
|
Tube | -40°C ~ 85°C | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
2,424
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-MSOP
|
Tube | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
4,321
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SOIC
|
Tube | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
3,105
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SOIC
|
Tube | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
9,386
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-MSOP
|
Tube | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
2,500
|
3 tage |
-
|
MOQ: 2500 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-MSOP
|
Tape & Reel (TR) | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
4,266
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-MSOP
|
Cut Tape (CT) | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
4,266
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-MSOP
|
- | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SOIC
|
Tape & Reel (TR) | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
1,112
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SOIC
|
Cut Tape (CT) | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
1,112
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SOIC
|
- | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
3,287
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Cut Tape (CT) | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
3,287
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
- | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
693
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-MSOP
|
Tube | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | ||
|
|
|
Microchip Technology |
400
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TSSOP
|
Tube | -40°C ~ 85°C | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | Surface Mount | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V |
