Entdecken Sie 9 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Packaging Operating Temperature Package / Case Supplier Device Package Mounting Type
DS17485-3+
Maxim Integrated
96
3 tage
-
MOQ: 1  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-DIP
Tube 0°C ~ 70°C 24-DIP (0.600",15.24mm) 24-PDIP Through Hole
DS17487-3IND+
Maxim Integrated
56
3 tage
-
MOQ: 1  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube -40°C ~ 85°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17485S-3+
Maxim Integrated
Anfrage
-
-
MOQ: 60  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-SOIC
Tube 0°C ~ 70°C 24-SOIC (0.295",7.50mm Width) 24-SOIC Surface Mount
DS17487-3+
Maxim Integrated
Anfrage
-
-
MOQ: 42  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube 0°C ~ 70°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17485-3
Maxim Integrated
Anfrage
-
-
MOQ: 1008  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-DIP
Tube 0°C ~ 70°C 24-DIP (0.600",15.24mm) 24-PDIP Through Hole
DS17485S-3
Maxim Integrated
Anfrage
-
-
MOQ: 1023  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-SOIC
Tube 0°C ~ 70°C 24-SOIC (0.295",7.50mm Width) 24-SOIC Surface Mount
DS17487-3
Maxim Integrated
Anfrage
-
-
MOQ: 42  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube 0°C ~ 70°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17487N-3
Maxim Integrated
Anfrage
-
-
MOQ: 45  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube -40°C ~ 85°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17485E-3+
Maxim Integrated
Anfrage
-
-
MOQ: 234  MPQ: 1
IC RTC CLK/CALENDAR PAR 28-TSOP
Tray 0°C ~ 70°C 28-TSSOP (0.465",11.80mm Width) 28-TSOP Surface Mount